See our discussion of our segment disclosures contained in Item 7-“Management’s Discussion and Analysis of Financial Condition and Results of Operations.” The Winchester segment produces and sells sporting ammunition, reloading components, small caliber military ammunition and components, and industrial cartridges, which represent 12% of fourth quarter 2015 sales. The Epoxy segment produces and sells a full range of epoxy materials, including allyl chloride, epichlorohydrin, liquid epoxy resins and downstream products such as converted epoxy resins and additives, which represent 34% of fourth quarter 2015 sales. The Chlor Alkali Products and Vinyls segment manufactures and sells chlorine and caustic soda, ethylene dichloride and vinyl chloride monomer, methyl chloride, methylene chloride, chloroform, carbon tetrachloride, perchloroethylene, trichloroethylene and vinylidene chloride, hydrochloric acid, hydrogen, bleach products and potassium hydroxide, which represent 54% of fourth quarter 2015 sales. There are also in the scientific literature some examples of bubble trap devices that can be microfabricated and added to the fluidic setup.We are a manufacturer concentrated in three business segments: Chlor Alkali Products and Vinyls, Epoxy and Winchester. ![]() Soft surfactant: In order to help detaching the bubble, a buffer with a soft surfactant (such as SBS) can be flushed through the fluidic path.ĭebubbling/Degassing systems: It is possible to use Bubble Trap for Microfluidics Kit in the microfluidic setup to get rid of air bubbles coming up inside the microfluidic chip. By applying pressure at each inlet of the microfluidic chip for a certain time, the air bubble can be forced to dissolve into the liquid. When using a pressure controller, applying a square shaped pressure signal often works nicely.īubbles dissolution: For those that are very difficult to detach, an alternative solution is to dissolve them. Pressure pulses: Applying pressure pulses is a very good way to detach air bubbles. This solution is not always appropriate, especially when dealing with cells or fragile microfluidic chips. Pressure increase: Increasing the pressure inside your fluidic path can help detaching air bubbles from the tubing and channels walls. Leaking issue: Air bubbles can appear during microfluidic experiments if one or several fittings are leaking.ĭissolved gas: Gas contained in gaseous form in the liquids used during the experiment can cause air bubbles to form. It is especially the case when the liquids are heated during the experiments. Porous material: Porous materials, such as PDMS, can induce air bubbles inside microfluidic chips, especially in long term experiments. If you change the liquid inside the reservoir, you might need some time to eliminate the amount of air introduced into the microfluidic setup. Depending on your setup and chip configuration, some residual bubbles can survive after the setup is fully filled with water.įluid switch: When changing the injected liquid during an experiment, the same phenomenon can appear. During this time, a large amount of air can circulate into your setup. ![]() Start of the experiment: When the flow controller device is set up, it can take some time before your microfluidic setup is entirely filled with water. ![]() ![]() Identifying what is causing your microfluidic chip to fill up with bubbles is the first step to eliminate them. Air bubbles inside microfluidic channels can have several different origins.
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